What you'll do
- Deliver photonics packaging solutions for various LiDAR & sensing product lines
- Experience with laser integration on chip including design trade offs, process flows, test and reliability
- Experience with multi-channel, multiwavelength laser integration including single and multi-emitter configuration and corresponding photonics requirements
- Experience with photonics packaging with electronics with an emphasis on advanced packaging technologies such as flip chip integration, FOWLP and BGA packages.
- Define characterization to assess impacts from packaging to photonic components
- Drive characterization of photonics to solve system integration challenges
- Drive validation through the product development cycle
What you have
- 5+ years of experience with Photonics Packaging
- 10 years’ experience with delivering integrated packages for photonics chipsets to product
- Experience with 5 years or more of photonics packaging
- Experience working cross functionally to resolve challenges during product integration
- Strong presentation, communication skills and results orientation
- Experience with working with cross functional teams to deliver cutting edge products
What's in it for you
- Be part of a fast paced and dynamic team
- Very competitive compensation and meaningful stock grants
- Exceptional benefits: Medical, Dental, Vision, and more
- Unlimited PTO: We care about results, not punching timecards
