Senior Mechanical Engineer - RF Packaging

Intro

• Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today, Astranis satellites provide dedicated, secure networks to highly-sophisticated customers across the globe— large enterprises, sovereign governments, and the US military. With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts.Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization. Astranis has raised over $750 million from some of the world’s best investors, from Andreessen Horowitz to Blackrock and Fidelity, and employs a team of 450 engineers and entrepreneurs. Astranis designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California, USA.
• As an Astranis Senior Mechanical Engineer for Electronics Packaging you will own the complete lifecycle of various components and subsystems on our spacecraft. Whether it is incremental improvements or the introduction of a new system, you will work together with the various other teams at Astranis to make them a reality.  In addition to being a significant individual on your own, you will mentor and train junior mechanical engineers on such projects. You must have a strong problem-solving background, hands-on testing skills, and preferably some experience with spacecraft and/or aerospace engineering.
• Complete ownership of product outcomes for spaceflight hardware, with a focus on high frequency active and passive RF and digital electronics
• Develop requirements for subsystems and components including loads, interfaces, and functional requirements
• Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements
• Develop and define design best practices for future programs
• Manage system level schedule and integration requirements for your components while working together with the Assembly, Integration, and Test team to enable a smooth build process
• Assist in recruiting, interviewing, and hiring additional teammates to our rapidly-growing team.
• B.S. or M.S in mechanical, electrical, aerospace engineering, or equivalent
• 4 - 15+ years of mechanical design or equivalent experience
• 3+ years designing, analyzing, and testing active or passive high frequency RF electronics packages.  Examples include phased array antenna packaging, SSPAs, waveguide assemblies, feedplanes, filters, RF enclosures, and MUX/DEMUX.
• Familiarity with chip and wire and splitblock construction
• Strong CAD design and Finite Element analysis skills
• Experience with GD&T and designing for manufacturability
• Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30-40 components in aerospace or similar
• A passion for hardware development, including working in a fast-paced environment with hands-on design and development
• A motivated leader who has experience mentoring and supporting junior engineers
• Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.
• Experience with Ku, Ka, and Q/V band electronics package development for space missions
• Experience with thermal analysis and thermal management techniques for RF electronics in space applications, including with heat pipes
• Experience with vibration environments and mechanical testing on spacecraft components
• Experience with brazed construction techniques for RF packages
• Experience in synthesizing requirements and flowing them down to sub-scale verification builds and testing