RESPONSIBILITIES:
- Lead and align multi-disciplinary engineering teams, including Electrical, Mechanical, Firmware, Sensors and Manufacturing, to deliver new WHOOP hardware products
- Manage complex integrated projects from kickoff through launch, keeping in mind performance, schedule, and cost goals
- Create and manage detailed project schedules based on WHOOP’s goals, balancing timelines, resources, and risks.
- Lead the project team through strategic and tactical shifts by driving clarity and alignment.
- Lead the execution of development builds from Prototype through DVT with internal and external partners.
- Drive prioritization and planning of test activities with the Technical Leads, from focused design-of-experiments (DOEs) to large-scale beta tests.
- Own and evolve the risks and issues framework, ensuring effective mitigation strategies and transparent reporting to stakeholders.
- Communicate project updates and drive key decisions at the executive level.
QUALIFICATIONS:
- Degree in Engineering or equivalent practical experience in hardware development
- 5+ years of industry experience managing complex hardware development projects, ideally in consumer electronics
- Launched at least one hardware product with cross-functional dependencies, either as an engineer or project manager
- Experience coordinating with Engineering, Manufacturing, and global partners
- Working knowledge of hardware lead-times and electrical development workflows
- Strong organizational, multi-tasking, and time management skills with the ability to thrive in fast-paced, ambiguous environments
- Excellent communication and stakeholder management skills, both written and verbal
- Ability to travel internationally to support engineering builds (up to 10%)
